Precise Temperature Control and Fast Response: Compact High-Efficiency Cooling Solutions Unlock Device Performance

At the beginning of 2026, CES clearly revealed two major trends in AI terminal devices: a significant increase in on-device AI computing power and the diversified implementation of Physical AI (embodied intelligence) devices. Whether it is the new-generation mobile platforms launched by chip manufacturers such as Qualcomm and MediaTek, or the AR glasses, smart vehicles, and robots showcased by numerous brands, all of them have placed higher demands on thermal management technology.

These trends all point to one core requirement: cooling systems must become more efficient, more compact, and smarter.

Without excellent thermal management, even the most powerful chips cannot sustain their performance over time.

The microfluidic cooling system launched by BESTAR is precisely an innovative solution designed to address this industry challenge. The system offers two active cooling solutions, liquid cooling and air cooling, both of which are based on piezoelectric ceramic technology (PZT).

The core of the microfluidic liquid cooling active thermal management system is a highly efficient closed-loop circulation driven by a PZT micropump. The system utilizes the inverse piezoelectric effect of piezoelectric ceramic sheets (PZT), generating precise vibrations under alternating current, which drives the coordinated operation of the pump chamber and valves, allowing the working fluid to be periodically drawn in and expelled. The fluid then continuously circulates through microchannels formed by bonding, efficiently transferring heat generated by the heat source to the cooling region, and achieving uniform heat dissipation through the liquid cooling film. Ultimately, this enables precise temperature control, rapid cooling, and surface temperature uniformity.

Thermal imaging tests show that the system can reduce the temperature of the heat source by approximately 10°C within 2 seconds, achieve a cumulative temperature drop of around 16°C within 20 seconds, and control the surface temperature difference within a range of 1.5°C.

The air cooling solution, on the other hand, utilizes the inverse piezoelectric effect generated by piezoelectric ceramic sheets under high-frequency alternating current, driving metal blades to vibrate at high frequency (≥20,000 times per second). This process does not require a traditional motor and therefore features low noise and no electromagnetic interference. The vibration of the blades generates strong air pressure fluctuations, efficiently drawing in cool air and forming a high-speed directional air jet, which precisely impacts the chip heat source and achieves forced convection cooling within a centimeter-scale range.

Transforming these sophisticated principles into practical and highly efficient cooling devices is by no means easy. It requires a deep understanding of the response characteristics of piezoelectric materials, precise control of vibration modes, and the collaborative optimization of structural design, along with excellent system integration capabilities.

At present, BESTAR’s microfluidic cooling technology has been successfully applied in multiple fields, including consumer electronics, power banks, smart vehicles, and wearable health devices, demonstrating mature cross-industry solution capabilities.

This technology provides efficient thermal management for leading smartphones, tablets, and wireless routers to address the heat challenges of high-performance chips. It also offers dedicated cooling solutions for high-power power banks, ensuring the stability and safety of fast charging. In the field of in-vehicle wireless charging, it has been applied to develop an intelligent thermal management solution for a leading automotive brand, effectively controlling temperature rise during the wireless charging process and ensuring charging efficiency as well as device safety. In addition, the application of this technology has expanded into the wearable health monitoring field, where it has successfully supported the air pump project of a well-known smartwatch manufacturer for precision health functions such as non-invasive blood pressure monitoring.

All of these cooperation cases demonstrate that BESTAR’s microfluidic cooling technology, with its high back pressure, high flow rate, ultra-thin size, and active temperature control capability, is gradually gaining recognition and being put into practice in consumer electronics, automotive electronics, smart wearables, and other fields.

In summary, on the path toward extreme computing power in smart devices, thermal management technology has evolved from a supporting component into a core factor that determines the upper performance limit of devices. With its features of miniaturization, precise temperature control, and high efficiency, BESTAR’s microfluidic cooling system shows broad application prospects across many fields.