A New Thermal Management Paradigm for the On Device AI Era

1.From CES 2026 to On Device AI
2.The Shared Challenge Behind On Device AI
3.BESTAR's Position
4.From Industry Cases to BESTAR's Own Work, Why Work With Us

From CES 2026 to On Device AI, How Micro Liquid Cooling and Active Fans Are Reshaping Phones, Tablets, and Robots
In January 2026, Infinix, the lifestyle tech brand under Transsion, took the stage at CES with what it called the industry's first two in one cooling system for smartphones, combining a piezoelectric fan with its HydroFlow liquid cooling architecture. The piezoelectric fan inside this system was co developed with the Chinese semiconductor company Ruimeng, marking the first time this kind of fan technology has been used inside a smartphone.
Built for demanding tasks and heavy gaming, Infinix's silent piezoelectric fan uses a vibrating sheet only 0.1 millimeters thick. It pulses more than 25,000 times a second to generate a focused, high pressure stream of air, delivering cooling performance the company says is more than ten times that of a traditional spinning fan, while running almost silently. The HydroFlow liquid cooling side of the system uses two piezoelectric ceramic pumps. Driven by electrical current, these pumps make the ceramic deform at high frequency, circulating coolant through microchannels at speeds up to 6.5 milliliters per minute and covering the key heat sources across the mainboard.
The entire active cooling module is built using precision metal and ceramic manufacturing, and the whole assembly is only about 2 millimeters thick. That means it can deliver serious, near industrial grade cooling performance for gaming and on device AI without meaningfully adding to the thickness of the phone. Infinix and Ruimeng have described this as a key technology in redefining what performance feels like on a mobile device.
This case sends a clear signal to the wider industry. Across phones, tablets, AI glasses, and robots, the old approach of passive cooling built around a single thick vapor chamber is running into real physical limits. Micro liquid cooling and active fans are becoming the new standard for thermal management in the on device AI era.

The Shared Challenge Behind On Device AI: Performance, Power, and Heat All Pulling Against Each Other
Industry analysts have pointed out that demand for liquid cooling and demand for robotics are growing at the same time, and that thermal management, power supply, motors, and sensors now sit on a shared technology stack across very different product categories. For humanoid robots, liquid cooling can be ten to fifty times more effective than air cooling, capable of bringing core temperatures down from around 100 degrees Celsius to below 60 degrees Celsius, which is what keeps a robot stable under heavy, sustained load.
For phones and tablets, the constraints look different but point to the same conclusion. A micro pump can be just a few cubic centimeters in size, with tubing thin enough to follow the curve of a device body or fold along a foldable hinge, adding only about 0.8 to 1.5 millimeters to overall thickness. That is a small enough number that it does not get in the way of a thin, portable design, which matters a great deal for devices where every fraction of a millimeter is scrutinized by product teams.
Taken together, these two examples point to the same underlying capability that phone, tablet, and robotics customers are now looking for in a thermal partner. The ability to build micro liquid cooling modules, build micro active fan modules, and design a coherent, system level thermal strategy around both, all at the same time, is quickly becoming a genuine competitive advantage, not just a nice to have.

BESTAR's Position: Deep Investment in Both Micro Liquid Cooling and Micro Active Fans
Based on this read of where on device AI and highly integrated devices are heading, BESTAR has continued to invest in both micro liquid cooling technology and micro active fan technology, working toward an integrated thermal management offering built for two core customer groups, phone and tablet makers, and robotics companies.
This is not a one time project or a single product launch. BESTAR treats thermal management as a long term area of investment, one where the underlying piezoelectric ceramic and precision manufacturing expertise the company has built up over years of electroacoustic component production carries over directly into cooling. That background matters here, because both piezoelectric fans and piezoelectric liquid pumps rely on the same core skill set BESTAR already applies every day, precisely shaping and driving piezoelectric ceramic elements at high frequency and tight tolerance.
In line with where the rest of the industry is heading, BESTAR keeps exploring new micro active cooling configurations, laying the groundwork for the thinner, lighter AI terminals and the more compact robot bodies that are coming next. Rather than offering a single fixed product, BESTAR works with customers early, adjusting pump size, flow rate, fan thickness, and noise level to match the specific chip, chassis, and use case in front of it.

From Industry Cases to BESTAR's Own Work, Why Work With Us
The piezoelectric fan and HydroFlow liquid cooling combination that Infinix and Ruimeng showed at CES 2026 has already proven that micro active cooling is both technically workable and commercially valuable inside a smartphone. On the robotics side, the advantage of liquid cooling in high power density situations keeps coming up in industry discussion, seen consistently as one of the key factors in keeping heavily loaded robots stable and reliable.
Against this backdrop, BESTAR has chosen to invest deeply in both micro liquid cooling modules and micro active fan modules at the same time, with a clear focus on two customer groups, phone and tablet makers, and robotics companies.
If your team is looking for the right thermal partner for a next generation AI phone, AI tablet, or humanoid robot, we welcome the chance to talk through your specific project needs and application scenario. Based on your power budget, space constraints, and cost targets, BESTAR can offer targeted thermal management recommendations and early stage design input to help move your project forward, from an initial feasibility discussion through to sample development.