BESTAR Powers the REDMAGIC Gaming Tablet 5 Pro with Advanced Liquid Cooling Technology for Next-Generation High-Performance Devices

The recent launch of the REDMAGIC Gaming Tablet 5 Pro has attracted wide attention from the consumer electronics industry and digital technology users. Developed by Nubia, a brand under ZTE, this high-performance gaming and productivity tablet showcases a series of flagship-level configurations in publicly available information, including a premium processor, a high-refresh-rate OLED display, fast charging, and a liquid circulation cooling system. These features reflect a clear trend in high-end mobile devices: higher computing power, faster refresh rates, slimmer designs, and long-lasting stable performance.

As a technology-driven company specializing in electronic thermal management, BESTAR Holding Co.,Ltd. participated in the R&D of key modules for the liquid cooling system used in the REDMAGIC Gaming Tablet 5 Pro. Focusing on the thermal challenges of flagship tablets under high-load scenarios, BESTAR developed a customized sealed microchannel two-phase liquid cooling module, providing solid thermal management support for sustained performance output, comfortable user handling, and long-term device reliability.

The evolution of high-performance terminals is making thermal management increasingly critical. For gaming tablets, demanding scenarios such as large-scale mobile games, high-definition video rendering, multitasking, office productivity, and AI applications can cause the main processor to generate intense heat within a short period of time. If heat cannot be efficiently transferred away from the core heat source, localized temperature spikes may occur, triggering thermal protection mechanisms and leading to throttling, frame drops, lag, and reduced file export efficiency. Excessive temperatures around the middle frame and heat source area can also directly affect the user’s grip comfort. In addition, prolonged operation under high temperatures may accelerate the aging of key components such as the display, battery, and processor, ultimately affecting the overall service life of the device.

To address these challenges, the liquid cooling module co-developed by BESTAR adopts a customized sealed microchannel two-phase cooling solution. The module is directly attached to the CPU core heat source. Through phase change and liquid flow of the specialized working fluid inside the chamber, concentrated heat generated by the chip is rapidly transferred and distributed. Compared with traditional thin-layer planar cooling structures such as graphite sheets and copper foils, this solution significantly improves the overall thermal capacity and heat transfer efficiency of the device, enabling more uniform temperature distribution across the body. By eliminating localized heat accumulation at the source, it creates favorable conditions for continuous and stable output from the flagship processor.

According to publicly disclosable test data, under a full-load continuous operation condition for one hour, the device equipped with this liquid cooling solution achieved an average main processor temperature reduction of approximately 7–12°C compared with traditional cooling solutions, while the surface temperature of the device decreased by approximately 5–8°C. In terms of performance, the duration of sustained high-load operation without frequency throttling increased by more than 180%, while gaming frame rate fluctuation was reduced by 40%–55%. In addition, after 10,000 cycles of high- and low-temperature shock testing from -40°C to 70°C, the liquid cooling module showed no leakage, with overall performance degradation kept below 5%, demonstrating excellent reliability and long-term stability.

This achievement was made possible by the R&D team's continuous breakthroughs in structure, materials, processes, and validation. At the early stage of the project, the team faced multiple technical challenges, including limited internal tablet space, difficulty in forming an ultra-thin liquid cooling chamber, potential stratification of the two-phase working fluid formula, and leakage risks in ultra-thin sealing processes. In response, the team carried out six rounds of structural iterations and tested more than 20 fluid formulations based on the internal layout and core heat source of the device. By optimizing the microchannel flow distribution structure, the team improved heat exchange efficiency and temperature uniformity. Through enhanced composite welding processes for the chamber, the sealing reliability of the module was further strengthened, ultimately forming a customized liquid cooling solution that perfectly matches the application requirements of flagship tablets.

Throughout this process, BESTAR gained a deeper understanding that thermal design for high-end consumer electronics is no longer a simple combination of materials or standalone modules. Instead, it is a system-level engineering project that runs through product concept development, structural design, thermal simulation, material selection, process manufacturing, and reliability verification. A liquid cooling module must not only deliver excellent heat exchange efficiency, but also meet key requirements such as slim design, high sealing performance, long-term stability, mass production consistency, and smooth integration into the complete device assembly. Every structural detail, every fluid formulation, and every packaging process has a tangible impact on the real user experience of the final product.

BESTAR has long focused on the thermal management needs of high-power-density electronic products. The company continues to invest in R&D across microfluidic structure design, specialized fluid formulation, MEMS architecture packaging, precision manufacturing, and reliability validation. Its participation in the liquid cooling system development for the REDMAGIC Gaming Tablet 5 Pro represents an important milestone in BESTAR's practice within the high-end consumer electronics thermal management field, while also reflecting the company’s deep technical collaboration with leading industry brands.

As mobile terminals, artificial intelligence devices, smart wearables, new energy electronics, and high-computing-power hardware continue to evolve, thermal management technology is moving beyond single-material heat spreading toward a new stage of structural design, phase-change heat transfer, microchannel cooling, and system-level collaborative optimization. Advanced technologies such as liquid cooling, two-phase heat transfer, and microchannel heat exchange will play an increasingly important role in more high-performance electronic products. BESTAR believes that future product competition will not be defined only by chip specifications, display quality, or battery capacity, but also by thermal management capability, system stability, and long-term reliability.

As a company rooted in Changzhou and dedicated to serving the high-end electronics supply chain, BESTAR has always placed technological innovation at the core of its development and customer needs at the center of its services. The company continues to enhance its R&D capabilities and engineering strength in specialized thermal management fields. Its participation in the REDMAGIC Gaming Tablet 5 Pro project is not only a strong demonstration of BESTAR's technical capabilities, but also an important achievement in serving benchmark brands and contributing to the R&D of high-end terminal products.

Looking ahead, BESTAR will continue to increase its investment in advanced thermal management technologies and pursue breakthroughs in high-efficiency, high-reliability, and highly integrated cooling solutions. The company will further promote the application of advanced liquid cooling, microchannel cooling, phase-change heat transfer, and precision packaging technologies across a wider range of industries. Taking this project as a new starting point, BESTAR will continue to strengthen its technical capabilities and service value within the consumer electronics thermal management supply chain, providing customers with higher-quality customized solutions and contributing BESTAR's expertise to the development of advanced manufacturing and next-generation electronics.