Next-Generation Piezoelectric Cooling Unit

Piezoelectric Liquid Cooling Module for Compact AI & Consumer Electronics

Miniature active cooling solutions for high thermal density devices, including AI chips, AR/VR devices, smart wearables, smartphones and ultra-thin PCs.

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Why Traditional Cooling Is Reaching Its Limit

Limited internal space in compact electronics
Higher heat flux from AI chips and high-performance processors
Noise and mechanical constraints of traditional fans
Passive cooling and conventional pumps struggle with sustained loads (size/noise/wear)

Our Solutions

● Piezoelectric cooling modules use compact active flow control to support localized heat dissipation in space-limited devices where traditional fans or pumps are difficult to integrate.

Our Products

Product Number:
• MMP10
Product Features:
• Small Size
• Ultra-thin
• Low Noise

Product Features
• Excellent flow performance
• Silent, Vibration-free Operation
• Ultra-fast Millisecond-level Response
• Light Weight, Compact Appearance
• Extremely Thin

Product Number
• BPP30A
Product Features
• Excellent Pressure and Flow Performance
• Silent, vibration-free operation
• Ultra-fast Millisecond-level Response
• Light Weight, Compact Appearance

Send Your Requirement

Core Advantages

Active Cooling Close to the Heat Source

Driven by a piezoelectric micro pump, the liquid cooling module circulates coolant through micro channels to remove heat near chips, AI processors and localized hot spots.

Miniaturized Design for Limited Space

Compared with traditional fans or mechanical pumps, the compact piezoelectric liquid cooling module is suitable for space-limited electronics such as AR/VR devices, wearables, ultra-thin devices and edge AI terminals.

Low-Noise and Low-Vibration Operation

With no traditional rotating fan structure, the piezoelectric driving method helps reduce mechanical noise and vibration, making it suitable for noise-sensitive consumer electronics.

Designed for High Thermal Density Devices

Suitable for AI chips, high-performance processors, edge computing devices and compact high-power electronic modules that require stable thermal performance during continuous operation.

Applications

Smartphone
VR/AR Devices
Wearables
Ultra-Thin AI PC
Edge AI Devices
Portable Projectors
Handheld Gaming Devices
Smart Cameras / AI Cameras

Why Choose BESTAR for Piezoelectric Liquid Cooling Projects

Miniaturized Cooling Product Development

BESTAR focuses on compact thermal management solutions for high-density electronic devices. Our piezoelectric liquid cooling module is designed for applications where traditional fans or mechanical pumps are limited by size, noise or structure.

Engineering Support for Product Selection

Not sure which cooling solution is suitable for your device? Send us your heat source power, available space, flow rate, pressure and noise requirements. Our engineering team can help evaluate your application and recommend a suitable solution.

Customization for Compact Electronic Devices

We support project-based customization according to size limitation, working voltage, flow rate, pressure, connector, installation method and cooling structure. This helps the module fit into compact devices such as AI terminals, AR/VR devices, wearables and ultra-thin electronics.

Testing and Reliability Validation

To support project evaluation, we can provide testing and validation for key performance factors such as flow rate, pressure, noise, power consumption, temperature rise, leakage risk, lifetime and continuous operation stability.

Support from Sample Testing to Mass Production

BESTAR can support customers from early-stage concept validation to sample testing and mass production supply. Send your drawing, specification or cooling requirement, and our team will provide technical feedback and quotation.

Get in Touch

Our engineering team supports you from concept to deployment.

Custom Design
Prototype Validation
CDU Integration